XPG SX8200 Pro M.2 512 GB PCI Express 3.0 3D TLC NVMe

XPG SX8200 Pro M.2 512 GB PCI Express 3.0 3D TLC NVMe

Technical details

RoHS

Features

Low-density parity-check (LDPC)	Y
NAND flash type	TLC (Triple Level Cell)
Interface	PCI Express 3.0
NVMe version	1.3
RAID support	Y
PCI Express interface data lanes	x4
ECC	Y
SSD form factor	M.2
Random write (4KB)	380000 IOPS
End-to-End Data Protection	Y
Read speed	3500 MB/s
SSD capacity	512 GB
NVMe	Y
Write speed	2300 MB/s
Component for	PC/notebook
Memory type	3D TLC
Mean time between failures (MTBF)	2000000 h
Random read (4KB)	390000 IOPS

Operational conditions

Operating relative humidity (H-H)	5 - 95%
Operating shock	1500 G
Operating temperature (T-T)	0 - 70 °C
Storage temperature (T-T)	-40 - 85 °C

Weight	8 g
Height	3.5 mm
Depth	22 mm
Width	80 mm

Other features

Black